Level Validation Across Multiple Platforms to build a Robust 2.5D Multi Foundry Chiplet Solution” was published by ...

A new technical paper titled “Analyzing Collusion Threats in the Semiconductor Supply Chain” was published by researchers at ...

U.S. lifts EDA export restrictions to China; collusion risk in the IC supply chain; Onto buys materials analysis biz; ...

A new technical paper titled “Hardware-software co-exploration with racetrack memory based in-memory computing for CNN inference in embedded systems” was published by researchers at National ...

AI drives workflow re-evaluation; DFT verification; hybrid control; managing AI coding agents; 3D-IC structural integrity.

A Hybrid Approach for Efficient Hardware Security Verification” was published by researchers at RPTU Kaiserslautern-Landau ...

Reflections from a recent panel discussion at DAC, The Chips to Systems Conference held at Moscone West on the CHIPS Act's impact on the design ecosystem ...

A technical paper titled “Data-driven power modeling and monitoring via hardware performance counter tracking” was published ...

A new technical paper titled “Patterned Multi-Wall Nanosheet FETs for Sustainable Scaling: Zero Gate Extension With Minimal ...

A new technical paper (preprint) titled “Extreme Ultraviolet and Beyond Extreme Ultraviolet Lithography using Amorphous ...

AI requires a lot of data, particularly for training models. The problem is that planar chips are unable to process all that ...

Defects can show up in the clock trees that drive scan chains, and even inside blocks of scan cells, which may number in the millions. Jayant D’Souza, technical product director for yield learning ...